Industry Directory | Distributor
UniversityWafer is a leading silicon wafer and semiconductor substrate supplier to for academia and industry. We provide high-quality, low cost wafers in small and large quantities. Why buy wafers in volume when you don't to!
Industry Directory | Manufacturer
Full service supplier of silicon wafers and wafer processing services, including polishing, reclaim, thermal oxide and back-grinding. Supplies silicon wafers in all specifications from 2in. to 300mm in diameter.
New Equipment | Design Services
Expert Printed Circuit Design services. PCB design and engineering services including designing characterization PCB boards for new silicon, developing test plans and providing characterization services. We provide custom hardware development, pcb b
An integrated circuit is a circuit with specific functions that integrates a number of common electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components through semiconductor technology. Thro
Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi
I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi
Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Used SMT Equipment | Semiconductor & Solar
· Dual Magnification, auto-focusing Optical System · DC brushless, 60,000 RPM closed-loop speed-controlled Air Bearing Spindle · Front loaded dual Cassette Compartment · Inspection Drawer - also used for single wafer load/unload · Dress Wafe
Used SMT Equipment | Drying Equipment
BRAND : SUPER DRY -02 SERIES MODEL : SD-3032-02 DESCRIPTIONS : "02 series are equipped with 1 patented dry unit to constantly main
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Industry News | 2021-04-19 03:58:42.0
Whizz Systems, Inc., the award-winning premier provider of electronics product design, development, and manufacturing services located in the heart of the Silicon Valley, today announced the appointment of Humza Babar as its new Marketing Associate.
Parts & Supplies | SMT Equipment
Specifications: Brand Name JUKI PLASTIC RAIL Part number 40046786 Model TSUBAKI TKP0450 58B R95 Ensure Test in machine confirmation Guarantee 1 month usage for machine FX-3 FX-3R Supply all JUKI motors at lower price JUKI 40034750 R3
Parts & Supplies | Board Cleaners
engine accessory ai rubber hose silicone rubber hose combusition engines Specifications high quality custom cnc machining aluminum metal part products Item high quality custom cnc machining aluminum metal part products Material Stainless Steel
Technical Library | 1999-08-05 10:45:36.0
In 1998, the International 300 mm Initiative (I300I) demonstration and characterization programs will focus on 180 nm technology capability. To support these activities, I300I and equipment supplier demonstration partners must use starting silicon wafers with key parameters specified at a level appropriate level for 180 nm processing, including contamination and lithographic patterning. This document describes I300I's silicon wafer specifications, as developed with the I300I Silicon Working Group (member company technical advisors) and SEMI Standards.
Technical Library | 2012-02-02 19:09:53.0
A miniaturized wafer-level packaged MEMS acceleration switch with through silicon vias (TSVs) was fabricated, based on technologies suitable for harsh environment applications. The high aspect ratio TSVs were fabricated through the silicon-on-insulator (S
The Foundation for Scientific and Industrial Research - SINTEF
Why you should attend International Wafer-Level Packaging Conference, October 23 - 25, 2018 in San Jose, California, USA.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Tue Feb 15 00:00:00 EST 2022 - Thu Feb 17 00:00:00 EST 2022 | San Jose, California USA
Wafer-Level Packaging Symposium
Events Calendar | Wed Feb 14 00:00:00 EST 2024 - Fri Feb 16 00:00:00 EST 2024 | San Francisco, California USA
Wafer-Level Packaging Symposium
Career Center | Charlton, Massachusetts USA | Engineering,Management,Production,Research and Development
MANUFACTURING / PROCESS ENGINEER Fused Fiber Optics company is seeking a Process Engineer to support its Optical Fabrication department. This position will be responsible for process development, optimization and troubleshooting, as well as the prep
Career Center | South Plainfield, New Jersey USA | Sales/Marketing,Technical Support
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Career Center | Melbourne, Florida USA | Management,Production,Quality Control
Technical Skills/Abilities: � Management � Quality Assurance � Strong Troubleshooting Skills � Strategic Planning � Employee Training � Quality Assurance � Problem Resolution � Mechanical/Technical Aptitude
Wafer-Level Packaged MEMS Switch With TSV Wafer-Level Packaged MEMS Switch With TSV by: Nicolas Lietaer, Thor Bakke, Anand Summanwar; SINTEF , Per Dalsjø, Jakob Gakkestad; Norwegian Defence Research Establishment (FFI), Frank Niklaus; KTH - Royal
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/bondtesters?con=t&page=7
Bondtesters – Bonding Test Equipment - Wafer Tests | Nordson Nordson Corporation Global Directory | Languages NASDAQ $230.50 -0.49 Our Products Our Industries Our Applications Brands
Surface Mount Technology Association (SMTA) | https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=4
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